Capacitively-coupled plasma processing system having a plasma processing chamber for processing a substrate

ABSTRACT

A capacitively-coupled plasma processing system having a plasma processing chamber for processing a substrate is provided. The plasma processing system includes at least an upper electrode and a lower electrode for processing the substrate, the substrate being disposed on the lower electrode during plasma processing. The plasma processing system further includes means for providing at least a first RF signal to the lower electrode, the first RF signal having a first RF frequency. The first RF signal couples with a plasma in the plasma processing chamber, thereby inducing an induced RF signal on the upper electrode. The plasma processing system further includes means for rectifying the induced RF signal to generate a rectified RF signal such that the rectified RF signal is more positively biased than negatively biased, wherein the substrate is configured to be processed while the rectified RF signal is provided to the upper electrode.

PRIORITY CLAIM

This divisional application claims priority under 37 CFR 1.53(b) of andclaims the benefit under 35 U.S.C. §120 to a commonly assigned patentapplication entitled “METHOD AND APPARATUS FOR PROCESSING A SUBSTRATEUSING PLASMA”, application Ser. No. 11/618,563 filed on Dec. 29, 2006,now U.S. Pat. No. 8,222,156.

CROSS REFERENCE TO RELATED APPLICATIONS

The present invention is related to the following applications, all ofwhich are incorporated herein by reference:

Commonly assigned application entitled “Plasma-Enhanced SubstrateProcessing Method and Apparatus”, filed on Dec. 29, 2009, having U.S.Pat. No. 8,262,847, issued on Sep. 11, 2012.

BACKGROUND OF THE INVENTION

In the processing of semiconductor substrates, plasma processing isoften employed. Plasma processing may involve differentplasma-generating technologies, for example, inductively-coupled plasmaprocessing systems, capacitively-coupled plasma processing systems,microwave-generated plasma processing systems, and the like.Manufacturers often employ capacitively-coupled plasma processingsystems in processes that involve the etching of materials using a photoresist mask.

Important consideration for plasma processing of substrates involves ahigh etch rate and a high photo resist selectivity. A high etch raterefers to the rate at which the target material is etched during plasmaprocessing. Generally speaking, the faster the underlying layer may beetched, a greater number of wafers may be processed per unit of time.All things being equal, manufacturers desire to process more wafers perunit of time to increase wafer processing efficiency. Photo resistselectivity refers to the discrimination between the photo resist maskand the underlying target layer during etching.

As circuit density increases, manufacturers are required to etch or toform a greater number of devices per unit area on the wafer. The higherdevice density requires a thinner photo resist layer. The thinner photoresist layer, in turn, tends to be more susceptible to beinginadvertently etched away. As a result, manufacturers constantly striveto create processing recipes that may etch the underlying layer at ahigh etch rate while avoiding damage to the photo resist mask.

One way to increase the etch rate is to increase the plasma densityduring plasma processing. In a capacitively-coupled plasma processingsystem, plasma density may be increased by increasing the power of thehigher frequency RF signals. To facilitate discussion, FIG. 1 shows aprior art multi-frequency capacitively-coupled plasma processing system100, representing the plasma processing system typically employed toprocess substrates. As seen in FIG. 1, multi-frequencycapacitively-coupled plasma processing system 100 includes a chamber 102which is disposed in between an upper electrode 104 and a lowerelectrode 106.

In the implementation of FIG. 1, lower electrode 106 is provided withmultiple RF frequencies, such as 2 Megahertz, 27 Megahertz, and 60Megahertz. Upper electrode 104 is grounded in the implementation ofFIG. 1. Multi-frequency capacitively-coupled plasma processing system100 also includes a plurality of confinement rings 108A, 108B, 108C, and108D. The confinement rings 108A-108D function to confine the plasmawithin chamber 102 during plasma processing.

There is also shown in FIG. 1 a peripheral RF grounded ring 110,representing the RF ground for the plasma generated within chamber 102.To isolate peripheral RF ground 110 from upper electrode 104, aninsulating ring 112 is typically provided. A similar insulating ring 114is also provided to insulate lower electrode 106 from an RF ground 116.During plasma processing, the RF power provided to lower electrode 106excites etching gas provided into chamber 102, thereby generating aplasma within chamber 102 to etch a substrate that is typically disposedon lower electrode 106 (substrate is not shown to simplify FIG. 1).

As discussed earlier, it is highly desirable to etch the target layer onthe substrate while the substrate is disposed in chamber 102 withoutunduly damaging the overlying photo resist mask. In the prior art,increasing the etch rate of the target layer may be achieved byincreasing the plasma density within chamber 102. Generally speaking,the plasma density may be increased by increasing the power level of thehigher frequency RF signals that are provided to lower electrode 106. Inthe context of the present invention, a high frequency RF signal isdefined as signals having a frequency higher than about 10 Megahertz.Conversely, RF signals with frequencies below 10 Megahertz are referredto herein as Low Frequency Signals.

However, by increasing the power level of the higher frequency RFsignals (e.g., the 27 Megahertz RF signal or the 60 Megahertz RF signalof FIG. 1), it may be challenging to confine the generated plasma withinchamber 102. Even if the plasma may be satisfactorily confined, electronloss to the upper electrode during plasma processing places an upperlimit on the plasma density within chamber 102. It has been found thatas the plasma density increases; electrons are lost to the groundedupper electrodes or other grounded surfaces of multi-frequencycapacitively-coupled plasma processing system 100, thereby causing theplasma density within chamber 102 to reach a saturation point. Beyondthe saturation point, increasing the RF power of the higher frequency RFsignal does not increase the plasma density since the electron lossoutpaces the generation of ions.

Furthermore, increasing the RF power to the higher frequency RF signalshas been found to adversely affect the photo resist selectivity. At ahigh RF power level, the photo resist mask is damaged to a greaterextent due to increased bombardment, which causes the photo resist maskto erode away at a faster rate, thereby negatively impacting the etchingprocess.

FIG. 2 shows a prior art implementation whereby one or more highfrequency RF signals 202 (e.g., the 60 Megahertz RF signal of FIG. 2)are provided to upper electrode 104 in order to provide additionalcontrol over the generation of ions within chamber 102. However, theimplementation of FIG. 2 still does not solve the aforementioned problemof plasma density saturation point effect. When the RF power level ofthe higher frequency signal provided to upper electrode 104 isincreased, the aforementioned saturation point effect is also observed,limiting the plasma density and consequently, the etch rate through thetarget layer irrespective of the increase in the RF power level to thehigher frequency RF signals.

Additionally, other prior art implementation has tried to control thephoto resist selectivity by controlling the temperature of theelectrodes. It has been found that the approach of controlling thetemperature of the electrodes is minimally effective in controlling thephoto resist selectivity. Furthermore, the approach of controlling thetemperature of the electrodes does not address the aforementionedproblem of plasma density saturation point effect.

Therefore, various aforementioned prior art implementations have provenineffective in increasing etch rate without adversely affecting ormaintaining high photo resist selectivity in capacitively-coupled plasmaprocessing system in processes that involve the etching of materialsusing a photo resist mask. In the prior art implementation of FIG. 1,the increase in RF power to the lower electrode may lead tounconfinement of plasma, saturation point of plasma density, andadversely affect the photo resist selectivity. Whereas in the prior artimplementation of FIG. 2, the increase in RF power to the upperelectrode may lead to saturation point of plasma density. Furthermore,the prior art implementation of controlling temperature of theelectrodes is minimally effective in controlling the photo resistselectivity while providing no solution for the plasma densitysaturation effect.

SUMMARY OF INVENTION

The invention relates, in an embodiment, to a method for processing asubstrate in a capacitively-coupled plasma processing system, which hasa plasma processing chamber and at least an upper electrode and a lowerelectrode. The substrate is disposed on the lower electrode duringplasma processing. The method includes providing at least a first RFsignal to the lower electrode. The first RF signal has a first RFfrequency. The first RF signal couples with a plasma in the plasmaprocessing chamber, thereby inducing an induced RF signal on the upperelectrode. The method also includes rectifying the induced RF signal togenerate a rectified RF signal such that the rectified RF signal is morepositively biased than negatively biased. The method further includesprocessing the substrate while the rectified RF signal is provided tothe upper electrode.

The above summary relates to only one of the many embodiments of theinvention disclosed herein and is not intended to limit the scope of theinvention, which is set forth in the claims herein. These and otherfeatures of the present invention will be described in more detail belowin the detailed description of the invention and in conjunction with thefollowing figures.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 shows a prior art multi-frequency capacitively-coupled plasmaprocessing system representing the plasma processing system typicallyemployed to process substrates.

FIG. 2 shows a prior art implementation whereby one or more highfrequency RF signals are provided to upper electrode in order to provideadditional control over the generation of ions within chamber.

FIG. 3 a shows an implementation wherein a rectifier circuit is employedto rectify the induced voltage that exists on upper electrode duringplasma processing.

FIG. 3 b shows an example RF signal.

FIG. 4 a shows an example plot of electron density on the y-axis versuselectron energy on the x-axis for a hypothetical plasma etch process.

FIG. 4 b shows an example plot of electron density for electrons havingvarious electron energy levels when rectification circuit is provided totrap more electrons within plasma chamber during plasma processing.

DETAILED DESCRIPTION OF EMBODIMENTS

The present invention will now be described in detail with reference toa few embodiments thereof as illustrated in the accompanying drawings.In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be apparent, however, to one skilled in the art, that the presentinvention may be practiced without some or all of these specificdetails. In other instances, well known process steps and/or structureshave not been described in detail in order to not unnecessarily obscurethe present invention.

Various embodiments are described hereinbelow, including methods andtechniques. It should be kept in mind that the invention might alsocover articles of manufacture that includes a computer readable mediumon which computer-readable instructions for carrying out embodiments ofthe inventive technique are stored. The computer readable medium mayinclude, for example, semiconductor, magnetic, opto-magnetic, optical,or other forms of computer readable medium for storing computer readablecode. Further, the invention may also cover apparatuses for practicingembodiments of the invention. Such apparatus may include circuits,dedicated and/or programmable, to carry out tasks pertaining toembodiments of the invention. Examples of such apparatus include ageneral-purpose computer and/or a dedicated computing device whenappropriately programmed and may include a combination of acomputer/computing device and dedicated/programmable circuits adaptedfor the various tasks pertaining to embodiments of the invention.

In accordance with embodiments of the invention, there are providedmethods and arrangements for controlling the electron loss to the upperelectrode such that the plasma density may be increased without the needto unduly increase the power to the plasma. By increasing the plasmadensity without a concomitant increase to the RF power requirement, thetarget layer may be etched at a higher rate without unduly degrading thephoto resist selectivity. In an embodiment, the upper electrode isconfigured such that the upper electrode is negatively biased, therebyallowing electrons present in the plasma chamber to be repelled from theupper electrode and trapped within the plasma chamber for a longerperiod of time. As the negatively charged electrons are trapped for alonger period of time, the plasma density is increased.

Generally speaking, during plasma processing the bombardment mechanismcauses electrons to be emitted from the substrate. As discussed earlier,electron loss to the upper electrode limits the increase in plasmadensity since the electron loss creates saturation point effect whichlimits the plasma density increase irrespective of the RF power providedto the plasma. In an embodiment, the induced RF signal on the upperelectrode is rectified, thus biasing the upper electrode morenegatively. Accordingly, the electrons are repelled from the upperelectrode instead of being quickly lost to the upper electrode,resulting in a greater number of electrons in the plasma, therebyincreasing the plasma density. In another embodiment, the rectified RFsignal is amplified, thus driving the upper electrode even morenegatively. The higher plasma density may effectively etch more of thetarget layer to achieve the desired high etch rate. Since it isunnecessary to increase the RF power to achieve the high level of plasmadensity, photo resist selectivity is not adversely affected to the samedegree as might have been in the prior art.

The above summary relates to only one of the many embodiments of theinvention disclosed herein and is not intended to limit the scope of theinvention, which is set forth in the claims herein. These and otherfeatures of the present invention will be described in more detail belowin the detailed description of the invention and in conjunction with thefollowing figures.

FIG. 3A shows, in accordance with an embodiment of the presentinvention, an implementation wherein a rectifier circuit 304 is employedto rectify the induced voltage that exists on upper electrode 302 duringplasma processing. As the term is employed herein, rectification refersto the process of reducing or eliminating the positive cycle of the RFsignal that exists on upper electrode 302.

With reference to FIG. 3B, an example RF signal 350 is shown. The dottedportion 352 and 354 of the RF signal 350 have been rectified away,leaving solid line 356 and 358, representing the negative portion of theRF signal. Since only the negative portion of the RF signal remains, theupper electrode 302 tends to be more negatively biased with respect tothe plasma that exists within plasma chamber 306.

In accordance with an embodiment of the present invention, electrons 308that are emitted from substrate 310 disposed atop lower electrode 312accelerate away from substrate 310 due to ion bombardment across thesubstrate sheath or the lower sheath (lower sheath is not shown tosimplify FIG. 3A). Instead of being immediately lost to upper electrode302 (as would be the case if upper electrode 302 is grounded, forexample) the negatively biased upper electrode 302 would repel electrons308, thereby causing electrons 308 to be trapped in between upperelectrode 302 and lower electrode 312 for a longer period of time. It isbelieved that eventually, through the mechanism of random collision,electrons 308 are eventually lost to RF ground 330. However, the longerresidence time of electrons 308 within plasma chamber 306 contributes toa higher plasma density without requiring a corresponding increase inthe amount of RF power supplied to plasma processing chamber 300.

Generally speaking, rectifier 304 may be constructed using any knownrectification circuitry, including, for example, power MOSFET. In anembodiment, rectifier circuit 304 further includes an amplificationcircuit to not only eliminate the positive cycle of the RF signal butalso to amplify or to reduce the amplitude of the negative portion ofthe RF cycle that remains. The ability to control the amplitude of thenegative portion of the RF signal that remains provides another controlknob for the process engineer during processing.

For example, it is known that lower energy electrons and higher energyelectrons impact the etch process in different ways. Trapping the lowerenergy electron requires, in an embodiment, that the upper electrode 302to be negatively biased to at least negative 100 volt. Trapping higherenergy electrons requires, in an embodiment, that the upper electrode benegatively biased to a higher negative value such as negative 500 voltor negative 600 volt or more. Since a high density of higher energyelectrons is believed to be beneficial for photo resist selectivity,manufacturers may desire in many cases to negatively bias upperelectrode 302 to cause more of the higher energy electrons to betrapped.

FIG. 4A shows an example plot of electron density on the y-axis versuselectron energy on the x-axis for a hypothetical plasma etch process. Inthe typical prior art case, the electron loss mechanism to the groundedupper electrode or to the upper electrode that is supplied with thehigher frequency RF signal as in the case of FIG. 2, limit the plasmadensity that may be achieved using a given level of RF power.

In the case of FIG. 4A, the area under curve 404 represents thedistribution of electrons at different energy level. The local maxima402 of the curve 404 represent the maximum electron density at thedensity level Y1 of electrons having energy level 406. Notice thatdistribution of electrons having a higher electron energy level (such asthose to the right of point 406 in FIG. 4A) do not exist at a highdensity level in the plasma chamber 306 during plasma processing. FIG.4B shows an example plot of electron density for electrons havingvarious electron energy levels when rectification circuit 304 isprovided to trap more electrons within plasma chamber 306 during plasmaprocessing.

In contrast to FIG. 4A, the electron density of the lower energyelectron, e.g., those having electron density denoted by referencenumber 406 now increases from electron density level Y1 to a higherelectron density level Y2, corresponding to maxima 452 of line 454.Further, by biasing upper electrode 302 more negatively, a greaternumber of higher energy electrons may be trapped.

The higher energy electrons is shown in FIG. 4B by another local maxima462 which corresponds to the maximum electron density captured ortrapped for electrons having electron energy level that corresponds toreference number 470. In the scenario of local maxima 462, not only dothe lower electrons (those associated with reference 406) exist in thechamber at a higher density level but the higher energy electrons (thoseassociated with reference number 470) also exist at a higher electrondensity level within the plasma processing chamber during plasmaprocessing. These higher electron density levels contribute to a higherplasma density during plasma processing to improve the etch rate to thetarget layer. Note that the mechanism to increase the plasma density ofFIG. 3A does not require the increase in the RF power supplied to the RFsignals (such as the 2 Megahertz RF signal, the 27 Megahertz RF signal,or the 60 Megahertz RF signal in the example of FIG. 3A). Consequently,the photo resist selectivity is not negatively impacted to the samedegree that would have been impacted had the higher plasma density beenachieved by increasing the RF power level.

As may be appreciated from the foregoing, embodiments of the inventionachieve a higher level of plasma density to improve etching through thetarget layer in the capacitively-coupled plasma processing chamberwithout unduly damaging the photo resist during etching. By providing amechanism for increasing the plasma density without requiring aconcomitant increase in the RF power level of the RF signals provided tothe plasma processing chamber, plasma density is increased while photoresist selectivity is maintained the same or is minimally impacted.

While this invention has been described in terms of several preferredembodiments, there are alterations, permutations, and equivalents, whichfall within the scope of this invention. Also, the title, summary, andabstract are provided herein for convenience and should not be used toconstrue the scope of the claims herein. It should also be noted thatthere are many alternative ways of implementing the methods andapparatuses of the present invention. Although various examples areprovided herein, it is intended that these examples be illustrative andnot limiting with respect to the invention. It is therefore intendedthat the following appended claims be interpreted as including all suchalterations, permutations, and equivalents as fall within the truespirit and scope of the present invention.

What is claimed is:
 1. A capacitively-coupled plasma processing systemhaving a plasma processing chamber for processing a substrate,comprising: at least an upper electrode and a lower electrode forprocessing said substrate, said substrate being disposed on said lowerelectrode during plasma processing; a generator for providing at least afirst RF signal to said lower electrode, said first RF signal having afirst RF frequency, said first RF signal coupling with a plasma in saidplasma processing chamber, thereby inducing an induced RF signal on saidupper electrode; a rectifying arrangement for rectifying said induced RFsignal to generate a rectified RF signal such that said rectified RFsignal is more negatively biased than positively biased, wherein saidsubstrate is configured to be processed while said rectified RF signalis provided to said upper electrode.
 2. The capacitively-coupled plasmaprocessing system of claim 1 wherein said rectifying includes removingpositive components of said induced RF signal.
 3. Thecapacitively-coupled plasma processing system of claim 1 furthercomprising the generator providing a second RF signal to said lowerelectrode, said second RF signal having a second RF frequency differentfrom said first RF signal.
 4. The capacitively-coupled plasma processingsystem of claim 3 wherein said second RF frequency is one of 2 MHz, 27MHz and 60 MHz.
 5. The capacitively-coupled plasma processing system ofclaim 1 wherein said rectifying further including amplifying anamplitude of said induced RF signal to generate said rectified RFsignal.
 6. The capacitively-coupled plasma processing system of claim 1wherein said capacitively-coupled plasma processing system represents amulti-frequency capacitively-coupled plasma processing system.
 7. Thecapacitively-coupled plasma processing system of claim 1 wherein saidrectifying said induced RF signal to generate said rectified RF signalis performed using said rectifying arrangement.
 8. Thecapacitively-coupled plasma processing system of claim 7 wherein saidrectifying arrangement includes a power MOSFET.
 9. Acapacitively-coupled plasma processing system having a plasma processingchamber for processing a substrate, comprising: at least an upperelectrode and a lower electrode for processing said substrate, saidsubstrate being disposed on said lower electrode during plasmaprocessing; a generator for providing a plurality of RF signals to saidlower electrode, a first RF signal of said plurality of RF signalshaving a first RF frequency, said first RF signal coupling with a plasmain said plasma processing chamber, thereby inducing an induced RF signalon said upper electrode; a rectifying arrangement coupled to saidinduced RF signal to generate a rectified RF signal such that saidrectified RF signal is more negatively biased than positively biased;and wherein said substrate is configured to be processed while saidrectified RF signal is provided to said upper electrode.
 10. Thecapacitively-coupled plasma processing system of claim 9 wherein saidrectifying arrangement includes circuitry configured to remove positivecomponents of said induced RF signal.
 11. The capacitively-coupledplasma processing system of claim 9 wherein said rectifying arrangementfurther includes circuitry configured to amplify an amplitude of saidinduced RF signal to generate said rectified RF signal.
 12. A plasmaprocessing system for processing a substrate and having a plasmaprocessing chamber, comprising: an upper electrode; a lower electrode,said substrate being disposed on said lower electrode during plasmaprocessing; a generator for providing at least a first RF signal to saidlower electrode, said first RF signal having a first RF frequency, saidfirst RF signal coupling with a plasma in said plasma processingchamber, thereby inducing an induced RF signal on said upper electrode;and a rectifying arrangement for reducing or eliminating at least apositive cycle of said induced RF signal to generate a rectified RFsignal such that said rectified RF signal is more negatively biased withrespect to said plasma, wherein said substrate is processed while saidrectified RF signal is provided to said upper electrode.
 13. The plasmaprocessing system of claim 12 further comprising the generator providinga second RF signal to said lower electrode, said second RF signal havinga second RF frequency different from said first RF signal.
 14. Theplasma processing system of claim 13 wherein said second RF frequency isone of 2 MHz, 27 MHz and 60 MHz.
 15. The plasma processing system ofclaim 12 further comprising an amplifier for amplifying an amplitude ofsaid induced RF signal to generate said rectified RF signal.
 16. Theplasma processing system of claim 12 wherein said capacitively-coupledplasma processing system represents a multi-frequencycapacitively-coupled plasma processing system.
 17. The plasma processingsystem of claim 12 wherein said rectifying arrangement includes a powerMOSFET.
 18. The plasma processing system of claim 12 further comprisingan amplifier for amplifying an amplitude of a negative portion of saidinduced RF signal to generate said rectified RF signal.
 19. The plasmaprocessing system of claim 12 wherein said rectifying arrangementincludes a rectifier circuit.
 20. The plasma processing system of claim19 wherein said rectifier circuit includes an amplification circuit foramplifying an amplitude of a negative portion of said induced RF signal.21. The plasma processing system of claim 19 wherein said rectifiercircuit is coupled with said upper electrode.
 22. The plasma processingsystem of claim 19 wherein said rectifier circuit is disposed outsidesaid plasma processing chamber.